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Ed Healy and Abhay Misra Join Cubic Wafer Management Team
09/12/2005
Austin, Texas - Cubic Wafer expands its management team by naming Ed
Healy, chief executive officer, and Abhay Misra, vice president of operations
and engineering. The new leadership team brings years of expertise and
relationships within the semiconductor industry. Additionally, the Cubic Wafer
headquarters have been relocated to Austin to accommodate growth as the company
brings its patented, proprietary process technology to market. Cubic Wafer
develops a proprietary process technology for vertical integration of
semiconductor die at the chip level, which will benefit everything from gaming,
memory, cameras and wireless, to data communication, data storage, PCs,
printers, networking and more. "The benefit of having a management team in place
with the skills Ed and Abhay bring is their ability to immediately capitalize on
our technology by implementing a strategic plan for achieving a revenue stream
in the short term without losing sight of our long term objectives," said Russ
Johnsen, chairman of the board of Cubic Wafer. "We are confident Cubic Wafer is
positioned to create an industry shift to transform and advance the integration
possibilities of the semiconductor industry."
"A truly unique dimension Cubic Wafer offers is our ability to bring
relevance to Moore's Law using today's technology," said Ed Healy, chief
executive officer of Cubic Wafer. "Attracting superior talent with a
demonstrated ability and strong track record for establishing and maintaining
operational excellence is not an easy accomplishment; however, we have succeeded
in doing just that with Abhay's commitment to join our team."
Healy and Misra plan to focus on developing partnerships with leading
semiconductor companies who will be implementing the Cubic Wafer process for
developing highly integrated circuits (ICs) for breakthrough applications while
enhancing production and dramatically reducing costs. The team will target Asian
foundries, assembly and packaging companies to transfer the Cubic Wafer
manufacturing process to achieve high volume capabilities.
Mr. Healy succeeds Russ Johnsen, interim CEO and chairman
of the board. Healy was previously vice
president of wireless products with Silicon Laboratories, a global leader in
mixed-signal integrated circuit technology with 2004 revenues of $456
million. In his role there, Mr. Healy established the company's wireless
business, growing it from a start-up venture in 1998 to a business
generating more than $230 million in annual revenue. Mr. Healy's
experience spans 15 years and includes serving as general manager of
the Magnetic Storage Division at Crystal Semiconductor/Cirrus Logic, Zilog and
GEC Plessey Semiconductor.
Mr. Misra brings extensive experience to his position, as vice president
engineering and manufacturing operations. Formerly, Misra served as director of
Manufacturing Technology and Supplier Management during his seven year tenure at
Silicon Laboratories. In this role, Misra's responsibilities included defining
manufacturing strategies, outlining technology roadmap, directing technology
usage, formulating operations strategy as well as managing and directing all
outsourced suppliers. Misra's expertise includes overseeing product lines from
conception to volume production and providing regular insight and leadership to
the Assembly, Foundry, Failure Analysis (FA) and CAD teams. Prior to joining
Silicon Laboratories, Misra served as director of Worldwide Foundry Operations
for Cyrix Corporation, which was acquired by National Semiconductor. Misra has
also held positions with Dallas Semiconductor, American Research Corporation and
Louisiana State University.
About Cubic Wafer
Cubic Wafer is a privately-owned company that delivers proprietary platform
technology to accomplish 3D chip stacking and integration without the size and
scalability limitations of conventional flip-chip and wire bond approaches.
Cubic Wafer's technology fuses integrated circuits (ICs) at the die or wafer
level thereby replacing expensive system-on-chip or system-in-package solutions
by providing unlimited integration capabilities and leveraging best-in-category
materials and suppliers. The result enables breakthrough high-density,
high-performance, multi-material and multi-functional ICs for the consumer
electronics, digital, wireless and data communications industries. Based in
Austin, Texas, Cubic Wafer has a development center in Merrimack, New Hampshire.
For more information on Cubic Wafer, visit www.cubicwafer.com or email info@cubicwafer.com. |
